cystech electronics corp. spec. no. : c303c3 issued date : 2010.11.02 revised date : page no. : 1/6 DAN202C3 cystek product specification switching diode DAN202C3 features ? fast switching speed. ? ultra small surface mount package ? high conductance ? pb-free package equivalent circuit outline applications ? for general purpose switching applications. ordering information device package shipping marking DAN202C3 sot-523 (pb-free) 3000 pcs / tape & reel n sot-523 DAN202C3 common cathode anode 1anode anode 2anode 3common cathode
cystech electronics corp. spec. no. : c303c3 issued date : 2010.11.02 revised date : page no. : 2/6 DAN202C3 cystek product specification absolute maximum ratings @t a =25 parameters symbol min max unit repetitive peak reverse voltage v rrm - 110 v continuous reverse voltage v r - 100 v average rectified forward current (single) i o - 150 ma repetitive peak forward current i fm 300 ma non-repetitive peak forward current @square wave, tj=125 prior to surge t=1 s t=1ms t=1s i fsm - - - 4 1 0.5 a a a power dissipation( note 1 ) p d 150 mw operating junction temperature range t j -55 +150 c storage temperature range t stg -65 +150 c note 1: device mounted on an fr-4 pcb. electrical characteristics @ ta=25 unless otherwise specified parameters symbol conditions min typ. max unit reverse breakdown voltage v r(br) i r =100 a 100 - - v forward voltage v f i f =1ma i f =10ma i f =50ma i f =150ma - - 715 855 1 1.25 mv mv v v reverse current i r v r =25v v r =100v - - 30 2.5 na a diode capacitance cd v r =0v, f=1mhz - - 2 pf reverse recovery time trr when switched from i f =10ma to i r =10ma,r l =100? , measured at i r =1ma - - 4 ns thermal characteristics symbol parameter conditions value unit rth, j-a thermal resistance from junction to ambient note 1 833 /w note 1: device mounted on an fr-4 pcb.
cystech electronics corp. spec. no. : c303c3 issued date : 2010.11.02 revised date : page no. : 3/6 DAN202C3 cystek product specification typical characteristics power derating curve 0 20 40 60 80 100 120 140 160 0 25 50 75 100 125 150 ambient temperature---t a () power dissipation---pd(mw) m ounting on glass ep oxy pcbs forward current vs forward voltage 0.1 1 10 100 0.2 0.4 0.6 0.8 1 1.2 forward voltage---v f (v) forward current---i f (ma) ta= - 40 ta= 2 5 ta=8 5 reverse leakage current vs reverse voltage 0.001 0.01 0.1 1 10 100 0 1020304050 reverse voltage---v r (v) reverse leakage current---i r( a) ta= 125 ta= 25 ta= 150 ta=55 ta=85 capacitance vs reverse voltage 0.52 0.56 0.6 0.64 0.68 00.20.40.6 reverse voltage---v r (v) diode capacitance ---c d (pf) 0.8 f=1mhz ta=25
cystech electronics corp. spec. no. : c303c3 issued date : 2010.11.02 revised date : page no. : 4/6 DAN202C3 cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c303c3 issued date : 2010.11.02 revised date : page no. : 5/6 DAN202C3 cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c303c3 issued date : 2010.11.02 revised date : page no. : 6/6 DAN202C3 cystek product specification sot-523 dimension (c forming) *: typical inches n h f 12 3 j a b c d e g i k l m o style: pin 1.anode 2.anode 3.common cathode 3-lead sot-523 plastic surface mounted package cystek package code: c3 marking: 3e_ _ : hfe rank code n millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.0079 0.0157 0.20 0.40 i *0.0197 - *0.50 - b 0.0591 0.0669 1.50 1.70 j 0.0610 0.0650 1.55 1.65 c 0.0118 0.0197 0.30 0.50 k 0.0276 0.0315 0.70 0.80 d 0.0295 0.0335 0.75 0.85 l 0.0224 0.0248 0.57 0.63 e 0.0118 0.0197 0.30 0.50 m 0.0020 0.0059 0.05 0.15 f 0.0039 0.0118 0.10 0.30 n 0.0039 0.0118 0.10 0.30 g 0.0039 0.0118 0.10 0.30 o 0 0.0031 0 0.08 h *0.0197 - *0.50 - notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0 important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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